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3D appearance inspection equipment - メーカー・企業と製品の一覧

3D appearance inspection equipmentの製品一覧

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HL-720 Tube-mounted IC 3D Appearance Inspection Device

HL-720 Tube-Mounted IC 3D Appearance Inspection Device

The HL-720 is a system that efficiently and precisely conducts appearance inspection, mark inspection, and surface inspection of ICs mounted on tubes using a high-precision 3D image measurement method. The process of the system is as follows: First, the marks and surfaces of the IC on the tube side are scanned in 2D using a moving CCD mounted on the head. After suctioning the IC, a 3D appearance inspection is performed on a fixed CCD, and the IC is stored in the outer side of the tube. Since the tube's inner and outer sides move alternately, the time loss during IC suction and storage is reduced. Additionally, the attachment and detachment of the tube can be performed with simple operations. The system is capable of inspecting and marking up to 8,000 leads per hour.

  • Other processing machines
  • Semiconductor inspection/test equipment
  • Visual Inspection Equipment

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Ultra-high-speed wire bond 3D appearance inspection device

It is a short-time inspection, 3D measurement, high-precision, customizable appearance inspection device.

This device is an image processing system that performs visual inspection of wires and bonding on a substrate at ultra-high speed (1 field per second). It consists of two stations: a three-dimensional image processing unit that measures the height of the wires and a high-resolution two-dimensional image processing unit that measures wire bending and ball placement. The two-dimensional and three-dimensional image processing units operate alternately, and there are two image processing PCs. All cameras are fixed, and the mechanical device moves the substrate. ■ Example of Device Configuration (Two-Dimensional Image Processing Unit) - 5-megapixel CCD camera - Lens with magnification of 1.5x - Blue LED dome coaxial illumination - LED power supply 3HC (Three-Dimensional Processing Unit) - 1.3-megapixel CCD camera - CCTV lens f=50mm - Red LED dome illumination - Image processing PC and camera capture board

  • Visual Inspection Equipment

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3D Appearance Inspection Machine for Raw Substrates 'ATHENA'

Inspection equipment that supports the quality inspection process of printed circuit board suppliers!

"ATHENA" is a 3D appearance inspection machine for printed circuit boards (raw substrates) that utilizes unique 3D inspection technology and advanced lighting technology to achieve surface appearance inspection and measurement that was impossible with conventional 2D inspections. By inspecting invisible defects in 2D and 3D, it supports the quality inspection processes of printed circuit board suppliers. Thanks to moiré technology, it can detect dents, bubbles, foreign objects, and other issues in 3D that cannot be found through 2D inspections. 【Features】 - Surface appearance inspection and measurement with advanced technology: 2D lighting, 3D lighting, coaxial lighting - High-speed 3D inspection and measurement - Surface inspection (2D, 3D, AI): defect inspection of substrates - More detailed inspection of the field of view (FOV) - Inspection based on substrate information (Gerber data) *For more details, please download the PDF or feel free to contact us.

  • Circuit Board Inspection Equipment

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